The introduction of the smartphone opened up more demand, putting leading-edge chips into the pockets of hundreds of millions of consumers, but now with the rise of cloud computing and artificial intelligence, there are more applications than ever. Next: EUV rolls into TSMC's 7+nm node in 2018 0000010655 00000 n TSMC also plans an ultra-low power version of its 12nm FinFET process, supporting 0.5V operation and starting risk production before June.

"The company's 7nm-based CPU product timing is shifting approximately six months relative to prior expectations," Intel said in a statement [PDF]. It has shipped 4.5 million 28nm wafers to date, clearly a big sweet spot it aims to defend. Furthermore, TSMC not only provides robust 7nm capacity with automotive-grade defect PPM, it is also committed to supporting the long life cycles of automotive products. We reiterate that we will distribute about 70% of free cash flow as cash dividend. 0000012490 00000 n This comes after Intel's 10nm node ran into years-long delays as the one-time semiconductor king went down a dead end with its assembly lines. A remarkable achievement for a technology that entered volume production in April 2018.

TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.

"The primary driver is the yield of Intel's 7nm process, which based on recent data, is now trending approximately twelve months behind the company's internal target.". The proliferation of different nodes, sub-nodes and platforms threatens to create a dizzying array of options.
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As part of its attempt to cover the waterfront, TSMC has revealed plans for an enhanced 7nm FinFET node using extreme ultraviolet lithography, a 12nm upgrade of its 16nm process and a 22nm planar technology—its answer to fully depleted silicon-on-insulator (FD-SOI).
0000025129 00000 n The foundry also described enhancements to its two chip-stacking techniques, advances in RF CMOS and work in transistors and materials, paving the way to a 3nm node and beyond. 0000004189 00000 n 0000067733 00000 n In fact, the technology behind it has been around for nearly a decade. 0000005257 00000 n

"The 7nm push isn't a positive announcement as many products were dependent on it. 7nm… 0000014071 00000 n 3, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today announced it has collaborated with Broadcom (NASDAQ: AVGO) on enhancing the Chip-on-Wafer-on-Substrate (CoWoS ®) platform to support the industry’s first and largest 2X reticle size interposer.With an area of approximately 1,700mm 2, this next generation CoWoS interposer technology significantly … The big announcement is TSMC's decision to use EUV for advanced 7nm variants. 0000000016 00000 n